Plasma-Thermis a global manufacturer of advanced plasma-processing equipment, providing etch, deposition, and plasma dicing technologies used in semiconductor packaging, solid-state lighting, power, data storage, renewable energy, MEMS, nanotechnology, photonics, and wireless communication markets. Plasma-Therm's products have been adopted globally and have earned their reputation for value, reliability, and world-class support. Named the #1 Etch Equipment Supplier in 2019, Plasma-Therm has more than two decades of awards in the VLSIresearch Customer Satisfaction Survey, including the highest score ever earned by a semiconductor equipment company.
“Zurich Instruments makes lock-in amplifiers, arbitrary waveform generators, impedance analyzers, quantum computing control systems, phase-locked loops and boxcar averagers. In combination with LabOne®, the Zurich Instruments control software, a new benchmark is set for instrumentation in the DC to Gigahertz range. This unique approach reduces the complexity of laboratory setups, removes sources of problems and supports new measurement strategies that enable the progress of research.
Scientists and engineers at advanced research laboratories and in leading hi-tech organizations require powerful measurement instrumentation and tools for dynamic signal analysis. Zurich Instruments equipment allows for robust and reliable setups with best-in-class performance thanks to the unique integration of the latest electronic components. This is backed up by scientific staff with detailed application know-how and a customer support organization that is also second to none.”
Emerging and Small Sensor Technology Companies: Exhibitor Zone
EUROPRACTICE provides low-cost technology access through MPW shuttles. We have been supporting customers with design tools, prototyping and training in ASIC, MEMS and photonics technologies for more than 20 years. The current service is being offered by IMEC (B), STFC-UKRI (UK), Fraunhofer IIS (D), CMP (FR) and TYNDALL (IRL). The existing services will be complemented and extended by adding new technologies (such as various sensor solutions) to serve new markets, by diversifying the service towards smart system integration and packaging, by encouraging new users from non-traditional sectors, and by training of future generations of engineers.